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Lenovo ThinkSystem SR670 V2 Server

The Lenovo ThinkSystem SR670 V2 is a versatile GPU-rich 3U rack server that supports eight double-wide GPUs including the new NVIDIA A100 and A40 Tensor Core GPUs, or the NVIDIA HGX A100 4-GPU offering with NVLink and Lenovo Neptune hybrid liquid-to-air cooling. The server is based on the new third-generation Intel Xeon Scalable processor family (formerly codenamed "Ice Lake") and the new Intel Optane Persistent Memory 200 Series.

The server delivers optimal performance for Artificial Intelligence (AI), High Performance Computing (HPC) and graphical workloads across an array of industries. Retail, manufacturing, financial services and healthcare industries can leverage the processing power of the GPUs in the SR670 V2 to extract greater insights and drive innovation utilizing machine learning (ML) and deep learning (DL).

The SR670 V2 features a modular design for ultimate flexibility. Multiple configurations are supported, including:

  • Up to eight double-wide GPUs with NVLink bridges
  • NVIDIA HGX A100 4-GPU with NVLink and Lenovo Neptune hybrid liquid cooling
  • Choice of front or rear high-speed networking
  • Choice of local high speed NVMe storage

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Form Factor:

3U rack

Processor:

Two third-generation Intel Xeon Scalable processor (formerly codenamed "Ice Lake"). Supports processors up to 40 cores, core speeds of up to 3.6 GHz, and TDP ratings of up to 270W.

Chipset:

Intel C621A "Lewisburg" chipset, part of the platform codenamed "Whitley"

Memory:

32 DIMM slots with two processors (16 DIMM slots per processor). Each processor has 8 memory channels, with 2 DIMMs per channel (DPC). Lenovo TruDDR4 RDIMMs and 3DS RDIMMs are supported. DIMM slots are shared between standard system memory and persistent memory. DIMMs operate at up to 3200 MHz at 2 DPC.

Persistent Memory:

Supports up to 16x Intel Optane Persistent Memory 200 Series modules (8 per processor) installed in the DIMM slots. Persistent memory (Pmem) is installed in combination with system memory DIMMs.

Memory Maximum:

With RDIMMs: Up to 4TB by using 32x 128GB 3DS RDIMMs With Persistent Memory: Up to 4TB by using 16x 128GB 3DS RDIMMs and 16x 128GB Pmem modules (1.5TB per processor)

Memory Protection:

ECC, SDDC (for x4-based memory DIMMs), ADDDC (for x4-based memory DIMMs, requires Platinum or Gold processors), and memory mirroring.

Disk Drive Bays:

Either 2.5-inch, 3.5-inch or EDSFF drives, depending on the configuration

PCI Expansion slots:

Up to 4x PCIe 4.0 slots, depending on the GPU and drive bay configuration selected

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